Comparison ledger
Disco DAD3220 and Disco Z09, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3220Disco | Z09Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | up to Φ8” workpieces |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3220 | Disco Z09 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | DAD3220[1] | DAD3241[2] |
| Code | SAW3[1] | — |
| Location | Sample Prep Room[1] | — |
| Max. workpiece size | — | Φ8”[2] |
| X-/Y-axis cutting range | — | 210 mm[2] |
| Cutting speed | — | 0.1-800 mm/s[2] |
| Index positioning accuracy | — | 0.002/210 mm[2] |
| Z-axis max. stroke | — | 32.2 mm[2] |
| Moving resolution | — | 0.000002 mm[2] |
| Repeatability accuracy | — | 0.001 mm[2] |
| Θ-axis max. rotating angle | — | 320°[2] |
| Rotation speed range | — | 6,000-60,000 rpm[2] |
| Spindle power | — | 1.8 kW[2] |
| Control interface | — | PC and touch screen via a specialized interface system[2] |
| Built-in microscope | — | Yes[2] |
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