Comparison ledger
Disco dad3240-dicing-saw and Disco DFL7340, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | dad3240-dicing-sawDisco | DFL7340Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco dad3240-dicing-saw | Disco DFL7340 |
| Specifications | ||
| vendor | Disco[1] | — |
| model | DFL7340[1] | — |
| process area | Packaging[1] | — |
| compatible materials | Si wafers only[1] | — |
| engine | SDE03 engine with λ = 1342 nm[1] | — |
| maximum sample diameter | 200 mm[1] | — |
| dicing orientation | Topside or backside (through tape) dicing possible[1] | — |
| Model | — | DFL7340[1] |
| OEM | — | Disco[1] |
| Process area | — | Packaging[1] |
| Compatible materials | — | Si wafers only[1] |
| Stealth dicing engine | — | SDE03 engine with λ = 1342 nm[1] |
| Maximum sample diameter | — | 200 mm[1] |
| Dicing orientation | — | Topside or backside (through tape) dicing possible[1] |
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