Disco
DFL7340
Wafer size
200mm
Optics
SDE03 engine with λ = 1342 nm[1]
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Dicing silicon wafers
- Stealth dicing of Si substrates
What do the numbers mean?
Wafer handling1
Optics & imaging1
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the DFL7340 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL7340 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFL7340 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFL7340 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFL7340 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFL7340 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [2]https://www.nanofab.ualberta.ca/category/fabrication/ — nanofab.ualberta.cananofab.ualberta.ca
Last updated Jul 29, 2026.
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