Disco

DFL7340

Dicing & Grinding 200mm Disco DFL7340 family

Research Quality: 60% complete

The Disco DFL7340 is a stealth dicing system for silicon wafer dicing. The Disco DFL7340 is dedicated to dicing Si wafers only. The Disco DFL7340 supports a maximum sample diameter of 200 mm.^[1]^[2]^[3]

DFL7340 — confluence.nanofab.ualberta.ca — Fig. 01DFL7340confluence.nanofab.ualberta.ca^[2]

Wafer size

200mm

Performance

3 µm^[3]

Optics

SDE03 engine with λ = 1342 nm^[2]

What it is

The Disco DFL7340 is a model used for silicon wafer dicing in dedicated packaging-area equipment sets.^[2]^[3]

How it works

The Disco DFL7340 uses a stealth dicing engine with a wavelength of 1342 nm.^[2]

Where it fits in the process flow

The Disco DFL7340 is used for dicing silicon wafers and supports topside or backside dicing through tape.^[2]

The Disco DFL7340 is intended for contactless dicing of silicon wafers in packaging assembly laboratory use.^[3]

Applications

The Disco DFL7340 is dedicated to dicing Si wafers only, and the compatible wafer size is up to 200 mm in diameter.^[2]

Dicing silicon wafers
Stealth dicing of Si substrates

What do the numbers mean?

Wafer handling9

Compatible materials: Si wafers only^[2]
Process: Laser stealth dicing of Si wafers^[3]
Compatible material: Si wafers only^[2]
Street clearance requirement: Wafer must be metal-free in a width of 0.4 × substrate thickness, centered on the dicing street^[4]
Category: Packaging & Bonding / Wafer Dicing / Stealth Dicer^[3]
Compatible materials: Dedicated to dicing Si wafers only (SDE03 engine with λ = 1342 nm)^[2]
Wafer sizes supported: 200mm wafers or smaller (6in, 4in, 3in, coupon, wafer quarter)^[3]
Maximum wafer thickness: Up to 1.5 mm thick wafers^[3]
Process purpose: Laser stealth dicing of Si wafers^[3]

Optics & imaging8

Stealth dicing engine: SDE03 engine with λ = 1342 nm^[2]
Laser engine wavelength: λ = 1342 nm^[2]
Process wavelength: IR^[3]
Surface roughness requirement: Dicing streets must be smooth (mirror polish) on the surface where the laser is incident^[4]2 sources
Backside alignment: IR camera for back side alignment^[3]
Laser wavelength: 1342 nm (IR)^[2]
Laser type: ns-pulsed near infrared laser^[1]
IR camera for back side alignment: IR camera for back side alignment^[3]

Performance2

Position accuracy: 3 µm^[3]
Position accuracy, X-axis & Y-axis: 3 µm^[3]

Configuration & options15

Model: DFL7340^[2]
OEM: Disco^[2]
Process area: Packaging^[2]
Maximum sample diameter: 200 mm^[2]
Dicing orientation: Topside or backside (through tape) dicing possible^[2]
Category: Packaging & Bonding^[4]
Feeding speed: 1.0–1000 mm/s^[3]
Si resistivity requirement: ρ > 0.01 Ω•cm^[4]2 sources
Automation mode: Fully automated mode^[3]
Vendor: Disco^[2]
Stealth dicing engine: SDE03^[1]
Dicing sides: Topside or backside (through tape) dicing possible^[2]
Feeding speed, X-axis & Y-axis: 1.0 – 1000 mm/s^[3]
Operation mode: Fully automated mode^[3]
At the nanoFAB: Staff processing only; user training not offered on this tool^[1]

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What material is the Disco DFL7340 dedicated to dicing?

The Disco DFL7340 is dedicated to dicing silicon wafers only.^[2]

What wafer diameter can the Disco DFL7340 handle?

The Disco DFL7340 supports wafers up to 200 mm in diameter.^[2]

Does the Disco DFL7340 support backside dicing?

The Disco DFL7340 supports backside dicing through tape.^[2]

Not publicly documented

The following facts about the DFL7340 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL7340 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFL7340 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFL7340 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFL7340 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFL7340 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources

[1]nanofab.ualberta.ca — nanofab.ualberta.cananofab.ualberta.ca
[2]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
[3]c2mi.ca — c2mi.cac2mi.ca
[4]waferpedia.comwaferpedia.com

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Last updated Oct 10, 2026.

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