Comparison ledger
Disco DAD3240 and Disco DFL7340, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3240Disco | DFL7340Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3240 | Disco DFL7340 |
| Specifications | ||
| Model | DAD3240[1] | DFL7340[5] |
| OEM | Disco[1] | Disco[5] |
| Equipment type | Automatic Dicing Saw[1] | — |
| Section | Bonding & Packaging[1] | — |
| Maximum substrate size | 200 mm (8 inch)[2] | — |
| Spindle power | 1.8 kW[2] | — |
| Spindle speed range | 6,000 rpm to 60,000 rpm[3] | — |
| Cut speed range | 0.000 to 600 mm/sec[4] | — |
| Index axis range | 210 mm[3] | — |
| Machine width | 650 mm[4] | — |
| Maximum depth left uncut | 0 mm to 10 mm in 0.001 mm increments[3] | — |
| Table stroke (X-axis) | defined by the circular shape of an 8-inch wafer[3] | — |
| Index step size range | 0 mm to 210 mm[3] | — |
| Spindle index range | 0 mm to 210 mm in 0.0001 mm increments[3] | — |
| Spindle stroke (Z-axis) | 210 mm[3] | — |
| Air supply pressure required | 0.4 MPa (minimum 0.35 MPa)[3] | — |
| Chuck vacuum level required | -60 kPa or more[3] | — |
| Display | 15-inch LCD touch panel[2] | — |
| Compatible wafer sizes | 1 inch to 8 inches[4] | — |
| Process area | — | Packaging[5] |
| Compatible materials | — | Si wafers only[5] |
| Stealth dicing engine | — | SDE03 engine with λ = 1342 nm[5] |
| Maximum sample diameter | — | 200 mm[5] |
| Dicing orientation | — | Topside or backside (through tape) dicing possible[5] |
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