Disco

DAD3240

Packaging & Bonding Disco DAD3240 family

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DiscoDAD3240

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Plate 01Disco DAD3240 - Automatic Alignment
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Plate 02Disco DAD 3240 Demo video
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Power

1.8 kW^[2]

Vacuum

0.4 MPa (minimum 0.35 MPa)^[3]

What it is

General reference — not yet source-verified

The DAD3240 is a dicing saw. Dicing saws are precision machines used to cut semiconductor wafers into individual chips or dies. The saw employs a rotating blade that cuts through the substrate along predefined streets. The wafer is held in place by a vacuum chuck.

How it works

General reference — not yet source-verified

The DAD3240 operates by mounting a dicing blade on a high-speed spindle. The blade rotates at high speed and is brought into contact with the wafer, which is held stationary on a vacuum chuck. The chuck moves in the X-axis (cutting feed) while the blade cuts through the material. After each cut, the spindle or chuck indexes in the Y-axis to the next cut position. The machine can perform multiple cuts in sequence automatically.

Where it fits in the process flow

General reference — not yet source-verified

The DAD3240 is used in the packaging stage of semiconductor manufacturing. Dicing is a back-end process that separates a wafer into individual dies after front-end processing, wafer thinning, and sometimes after wafer bonding. The singulated dies are then ready for die attach, wire bonding, or other assembly steps.

What can it run?

Process applications and technology nodes documented for this tool.

Die singulation

What do the numbers mean?

Power & electrical1

Spindle power: 1.8 kW^[2]

Vacuum & pumping2

Air supply pressure required: 0.4 MPa (minimum 0.35 MPa)^[3]
Chuck vacuum level required: -60 kPa or more^[3]

Wafer handling3

Maximum substrate size: 200 mm (8 inch)^[2]
Table stroke (X-axis): defined by the circular shape of an 8-inch wafer^[3]
Compatible wafer sizes: 1 inch to 8 inches^[4]

Dimensions & facilities2

Machine width: 650 mm^[4]
Maximum depth left uncut: 0 mm to 10 mm in 0.001 mm increments^[3]

Configuration & options11

Model: DAD3240^[1]
OEM: Disco^[1]
Equipment type: Automatic Dicing Saw^[1]
Section: Bonding & Packaging^[1]
Spindle speed range: 6,000 rpm to 60,000 rpm^[3]
Cut speed range: 0.000 to 600 mm/sec^[4]
Index axis range: 210 mm^[3]
Index step size range: 0 mm to 210 mm^[3]
Spindle index range: 0 mm to 210 mm in 0.0001 mm increments^[3]
Spindle stroke (Z-axis): 210 mm^[3]
Display: 15-inch LCD touch panel^[2]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Spindle power1.8 kW^[2]
Air supply pressure required0.4 MPa (minimum 0.35 MPa)^[3]
Chuck vacuum level required-60 kPa or more^[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What is the maximum substrate size the DAD3240 can handle?

The DAD3240 can handle workpieces up to 8 inches (200 mm) in diameter.^[4]^[5]^[3]^[2]

What is the spindle speed range of the DAD3240?

The spindle rotation speed is variable from 6,000 rpm to 60,000 rpm.^[3]

What is the cutting feed speed range of the DAD3240?

The cutting feed speed is adjustable from 0.000 mm/s to 600 mm/s.^[4]^[3]

Does the DAD3240 have automatic alignment?

Yes, the DAD3240 is equipped with an automatic alignment function.^[4]^[2]

Not publicly documented

The following facts about the DAD3240 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD3240 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD3240 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD3240 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD3240 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD3240 is not on record.
Answerable by: an OEM datasheet or a fab qualification report