Waferpedia

Comparison ledger

DAD641 versus DTG 8440

Disco DAD641 and Disco DTG 8440, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
DAD641Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DAD641Disco DTG 8440
Specifications
Tool typeDicing saw[1]
LocationBackend Lab[1]
Tool nameDisco DAD641[2]
Spindle TypeAir Bearings[3]
External CoolingWater Cooled[3]
Power200-208 V, 50/60 Hz, 3 Phase[3]
ConfigurationDisco DTU 1531 Chiller[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing