Comparison ledger
Disco DAG810 and Disco R07, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAG810Disco | R07Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 4" | up to Φ8” |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAG810 | Disco R07 |
| Cited variants | — | |
| Specifications | ||
| Equipment type | compact, automatic grinder[2] | — |
| Materials | silicon, III/V materials (GaN, GaAs, InP), and various glass types (pure amorphous SiO2, float glass, pyrex)[2] | — |
| Wafer sizes supported by universal vacuum chuck table | 4", 5", 6", and 8"[2] | — |
| Mechanical frame use | for UV-tape mounted wafers or chips[2] | — |
| Spindle | high-rigidity, low-vibration spindle[2] | — |
| Grinding wheels | dedicated wheels for coarse and fine silicon grinding, coarse and fine glass grinding, and GaN fine grinding[2] | — |
| Probe-height | real-time probe-height from 4" wafer size[2] | — |
| User interface | LCD touch screen[2] | — |
| Grinding speed | as high as 30 microns/min[2] | — |
| Thickness variation | total thickness variation close to one micron[2] | — |
| Surface roughness | less than 100 nm[2] | — |
| Model | — | DAD3241[3] |
| Max. workpiece size | — | Φ8”[3] |
| X-/Y-axis cutting range | — | 210 mm[3] |
| Cutting speed | — | 0.1-800 mm/s[3] |
| Index positioning accuracy | — | 0.002/210 mm[3] |
| Z-axis max. stroke | — | 32.2 mm[3] |
| Moving resolution | — | 0.000002 mm[3] |
| Repeatability accuracy | — | 0.001 mm[3] |
| Θ-axis max. rotating angle | — | 320°[3] |
| Rotation speed range | — | 6,000-60,000 rpm[3] |
| Spindle power | — | 1.8 kW[3] |
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