Waferpedia

Comparison ledger

DFL 7361 versus DFL 7560 L

Disco DFL 7361 and Disco DFL 7560 L, side by side. Every value shown is drawn from its cited encyclopedia entry.

LinkedIn X Email
Side-by-side comparison of selected equipment models
Attribute
DFL 7361Disco
DFL 7560 LDisco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeIntegrated Wafer Cleaning System with Atomizing NozzleRobot Wafer handling
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFLDisco DFL
Cited variants
  • SECS/GEM Software[1]
  • Intemal lighting[1]
  • Virus-free PC[1]
  • STM DFL7161 2021 SW unified[1]
  • Barcode reading function for auto recipe loading[1]
  • Compatibility with Hogomax 5L tanks[1]
  • Change of Laser Focus Position for Maintenance[1]
  • Additional Kerf check sequence[1]
  • Password Modification up to Level 4[1]
  • Disco CO2 Injector + Integration specs[1]
  • CO2 injector (stand-alone) added[1]
  • Addition of drain valve for CO 2 injector specific resistance value stabilization[1]
  • CO2 water target resistivity value Settable in device data[1]
  • CO2 bubbler support (RS232C)[1]
  • New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)[1]
  • 200mm Fully Automatic wafer handling from/to standard wafer cassette[2]
Specifications
ConfigurationType FX Laser Head[1]Operation by touch panel LCD monitor[2]
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle[1]Robot Wafer handling[2]
Wafer—Can be modified at later date to 3”, 4” & 6” wafers and frame[2]
Uninterruptible Power Supply—1[2]
DFL 7361 entryDFL 7560 L entry

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing