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DFL 7361 versus DTG 8440

Disco DFL 7361 and Disco DTG 8440, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
DFL 7361Disco
DTG 8440Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFLDisco DTG 8440
Cited variants
  • SECS/GEM Software[1]
  • Intemal lighting[1]
  • Virus-free PC[1]
  • STM DFL7161 2021 SW unified[1]
  • Barcode reading function for auto recipe loading[1]
  • Compatibility with Hogomax 5L tanks[1]
  • Change of Laser Focus Position for Maintenance[1]
  • Additional Kerf check sequence[1]
  • Password Modification up to Level 4[1]
  • Disco CO2 Injector + Integration specs[1]
  • CO2 injector (stand-alone) added[1]
  • Addition of drain valve for CO 2 injector specific resistance value stabilization[1]
  • CO2 water target resistivity value Settable in device data[1]
  • CO2 bubbler support (RS232C)[1]
  • New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)[1]
—
Specifications
ConfigurationType FX Laser Head[1]Disco DTU 1531 Chiller[2]
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle[1]—
Spindle Type—Air Bearings[2]
External Cooling—Water Cooled[2]
Power—200-208 V, 50/60 Hz, 3 Phase[2]
DFL 7361 entryDTG 8440 entry

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing