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Comparison ledger

DFL 7361 versus Z09

Disco DFL 7361 and Disco Z09, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
DFL 7361Disco
Z09Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzleup to Φ8” workpieces
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFLDisco Z09
Cited variants
  • SECS/GEM Software[1]
  • Intemal lighting[1]
  • Virus-free PC[1]
  • STM DFL7161 2021 SW unified[1]
  • Barcode reading function for auto recipe loading[1]
  • Compatibility with Hogomax 5L tanks[1]
  • Change of Laser Focus Position for Maintenance[1]
  • Additional Kerf check sequence[1]
  • Password Modification up to Level 4[1]
  • Disco CO2 Injector + Integration specs[1]
  • CO2 injector (stand-alone) added[1]
  • Addition of drain valve for CO 2 injector specific resistance value stabilization[1]
  • CO2 water target resistivity value Settable in device data[1]
  • CO2 bubbler support (RS232C)[1]
  • New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)[1]
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Specifications
ConfigurationType FX Laser Head[1]—
Wafer sizeIntegrated Wafer Cleaning System with Atomizing Nozzle[1]—
Model—DAD3241[2]
Max. workpiece size—Φ8”[2]
X-/Y-axis cutting range—210 mm[2]
Cutting speed—0.1-800 mm/s[2]
Index positioning accuracy—0.002/210 mm[2]
Z-axis max. stroke—32.2 mm[2]
Moving resolution—0.000002 mm[2]
Repeatability accuracy—0.001 mm[2]
Θ-axis max. rotating angle—320°[2]
Rotation speed range—6,000-60,000 rpm[2]
Spindle power—1.8 kW[2]
Control interface—PC and touch screen via a specialized interface system[2]
Built-in microscope—Yes[2]
DFL 7361 entryZ09 entry

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu