Comparison ledger
Disco DFL 7560 L and Disco DTG 8440, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DFL 7560 LDisco | DTG 8440Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | Robot Wafer handling | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL | Disco DTG 8440 |
| Cited variants |
| — |
| Specifications | ||
| Wafer size | Robot Wafer handling[1] | — |
| Wafer | Can be modified at later date to 3”, 4” & 6” wafers and frame[1] | — |
| Configuration | Operation by touch panel LCD monitor[1] | Disco DTU 1531 Chiller[2] |
| Uninterruptible Power Supply | 1[1] | — |
| Spindle Type | — | Air Bearings[2] |
| External Cooling | — | Water Cooled[2] |
| Power | — | 200-208 V, 50/60 Hz, 3 Phase[2] |
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