Waferpedia

Comparison ledger

101 versus 620

EV Group 101 and EV Group 620, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
620EV Group
OEMEV GroupEV Group
CategoryLithographyLithography
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyEV Group 101EV Group 620
Specifications
OEMEV Group[1]
Model101[1]
Equipment nameEVG 101 Spray Coater[1]
NEMO IDevgspraycoat[1]
Training requiredEVG 101 Training[1]
Training duration1.50 hours[1]
Processing techniqueResist Spray Coat (manual)[1]
Cleanliness"All"[1]
LocationSNF Paul G Allen L107 Cleanroom[1]
Wafer diameter (substrate size)up to 300 mm[2]
Available modulesSpin coat / OmniSpray® / develop[2]
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[2]
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]
Processing technique (at SNF)Resist Spray Coat (manual)[3]
Cleanliness group (at SNF)"All"[1]
ConfigurationMercury Lamp Exposure System[4]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]inventory listing
  5. [5]inventory listing