Comparison ledger
EV Group 101, Nikon NSR-2205i11D, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | NSR-2205i11DNikon |
|---|---|---|
| OEM | EV Group | Nikon |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | 0.35 micron |
| Introduced | — | — |
| Production run | — | 1995– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | Nikon NSR-2205i11D |
| Specifications | ||
| OEM | EV Group[1] | Nikon[4] |
| Model | 101[1] | NSR-2205i11D[4] |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Tool type | — | Step-and-Repeat System[4] |
| Process node | — | 0.35 micron[4] |
| Node | — | 0.35 micron[4] |
| Technology Node | — | 0.35 micron[4] |
| Type | — | Step-and-repeat system[4] |
| Resolution node | — | 0.35 micron[4] |
| Machine type | — | Step-and-Repeat System[4] |
| Target design node | — | 0.35 micron[4] |
| System type | — | Step-and-repeat system[4] |
| Target node | — | 0.35 micron[4] |
| Design node | — | 0.35 micron[4] |
| Node (resolution) | — | 0.35 micron[4] |
| Resolution | — | 0.35 micron[4] |
| Minimum feature size | — | 0.35 μm[4] |
| Design Rule | — | 0.35 micron[4] |
| Feature Size | — | 0.35 micron[4] |
| Description | — | State-of-the-art workhorse[4] |
| Equipment type | — | Step-and-repeat system[4] |
| Manufacturer | — | Nikon[4] |
| Described use | — | Step-and-Repeat System[4] |
| NA | — | 0.63[5] |
| Exposure source | — | i-line (365 nm wavelength)[5] |
| Reduction ratio | — | 1:5[5] |
| Maximum exposure field | — | 22 mm × 22 mm[5] |
| Overlay accuracy | — | ≤ 70 nm (EGA, |M| + 3σ)[5] |
| Alignment system | — | LSA (standard), FIA (optional), LIA (optional)[5] |
| Date of manufacture | — | 01 Sep 1995[6] |
| Serial number | — | 1105183[6] |
| Wafer size | — | 8 Inch[6] |
| Reticle size | — | 6 Inch[6] |
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