Waferpedia

Comparison ledger

101versusModel 30

EV Group 101, OAI Model 30, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMEV GroupOAI
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 101OAI Model 30
Specifications
OEMEV Group[1]—
Model101[1]—
Equipment nameEVG 101 Spray Coater[1]—
NEMO IDevgspraycoat[1]—
Training requiredEVG 101 Training[1]—
Training duration1.50 hours[1]—
Processing techniqueResist Spray Coat (manual)[1]—
Cleanliness"All"[1]—
LocationSNF Paul G Allen L107 Cleanroom[1]—
Wafer diameter (substrate size)up to 300 mm[2]—
Available modulesSpin coat / OmniSpray® / develop[2]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[2]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]—
Processing technique (at SNF)Resist Spray Coat (manual)[3]—
Cleanliness group (at SNF)"All"[1]—
Product family—UV Exposure Systems[4]
Type—Benchtop collimated UV exposure system[5]
Source type—Stabilized arc lamp source[5]
Optical integrator—Adjustable optical integrator[5]
Output spectra—220 nm to 450 nm[6]
Output power—200 W to 12 kW[6]
Beam size—Up to 24 in²[6]
Timer range—0.1 to 0.999 seconds[6]
Collimation—Reflective Köhler illumination design[5]
Beam divergence—≤ ±1.5°[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]oainet.comoainet.com
  5. [5]instrumenthive.cominstrumenthive.com
  6. [6]oainet.comoainet.com