Comparison ledger
EV Group 101, SUSS MicroTec MA 8 BA 8 Gen 5 S Compact Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | MA 8 BA 8 Gen 5 S Compact MaskSUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | SUSS MicroTec MA 8 Mask |
| Cited variants | — |
|
| Specifications | ||
| OEM | EV Group[2] | — |
| Model | 101[2] | — |
| Equipment name | EVG 101 Spray Coater[2] | — |
| NEMO ID | evgspraycoat[2] | — |
| Training required | EVG 101 Training[2] | — |
| Training duration | 1.50 hours[2] | — |
| Processing technique | Resist Spray Coat (manual)[2] | — |
| Cleanliness | "All"[2] | — |
| Location | SNF Paul G Allen L107 Cleanroom[2] | — |
| Wafer diameter (substrate size) | up to 300 mm[3] | — |
| Available modules | Spin coat / OmniSpray® / develop[3] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[3] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[4] | — |
| Cleanliness group (at SNF) | "All"[2] | — |
| Configuration | — | For imprint processing[1] |
| Power supply | — | 3x 400V AC + N + PE / 50-60Hz[1] |
| Max fuse rating machine | — | 30amp[1] |
| Max fuse rating facility | — | 40amp[1] |
| Connection cable | — | 5x AWG8 length 16ft / 5m open end, no connector[1] |
| Outer tube diameter | — | 6mm[1] |
| Max length | — | 2m[1] |
| According to purity level ISO 8573-1 | — | 2010, [5:6:4][1] |
| CDA Consumption | — | ca. 1 m3/h (LH350)[1] |
| AIC or main interrupt and breakers | — | 15 kA IEC[1] |
| Tool type | — | Compact Mask Aligner[1] |
| Use | — | For imprint processing[1] |
| Vacuum | — | <-80 kPa[1] |
| Clean Dry Air (CDA) | — | 0,5 to 0,8 MPa[1] |
| CDA purity | — | According to purity level ISO 8573-1:2010, [5:6:4][1] |
| Nitrogen (N2) | — | 0,2 to 0,5 MPa[1] |
| Voltage/Frequency | — | 200-240 V, L1/N/PE, or L1/L2/PE, 50/60hz[1] |
| SCCR (Short Circuit Current Rating) of overall equipment | — | 5 kA[1] |
| Apparent power | — | ca. 1,7 kVA max, inc. CIC1200 and 350 W lamp; ca. 1,0 kVA max, Bond Aligner without lamp[1] |
| Power cable | — | KABEL OELFLEX 491P BK 3 G2.5 RU AWM CSA[1] |
| Power cable length | — | 3 m[1] |
| Power plug | — | G146853 European Schuko Plug 16A/250V CEE7/7[1] |
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