Comparison ledger
EV Group 850 LT SOI Fusion Wafer, EV Group Gemini Automated Production Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 850 LT SOI Fusion WaferEV Group | |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 850 | EV Group Gemini Automated |
| Specifications | ||
| Configuration | Fully-Automatic[1] | with Face to Face Alignment[3] |
| Wafer size | Suitable for wafer sizes up to 8"/200mm wafers[1] | up to 8"/200mm[3] |
| OEM | EV Group[2] | — |
| Model | 850 LT SOI Fusion Wafer[1] | — |
| Category | Packaging & Bonding[2] | — |
| Automation | Fully-automatic[2] | Fully automated wafer loading, alignment, bonding and unloading[4] |
| Cleaning module | One Cleaning Module[1] | — |
| Spinner chuck | One Spinner Chuck for 8”/200mm wafers[1] | — |
| DI water dispense line | One DI Water Dispense Line[1] | — |
| Robot / pre-aligner | One Genmark Robot with pre-aligner[1] | — |
| Low-temperature plasma activation module | One LowTemp Plasma Activation Module[1] | — |
| High-frequency RF generator | High Frequency RF Generator with Matching Unit[1] | — |
| Low-frequency RF generator | Low Frequency RF Generator with Matching Unit[1] | — |
| Control interface | PC controlled with windows based graphical user interface[1] | — |
| Access control | Password protected access levels[1] | — |
| Cleaning speed | Programmable rotational speed for substrate cleaning[1] | — |
| Configured wafer size | 8-inch/200mm wafers[1] | — |
| Plasma activation module | One LowTemp Plasma Activation Module[1] | — |
| Tooling included | — | 8” bond chucks (additional tooling can be offered)[3] |
| Temperature | — | 4 Bond modules with up to 550°C and 20kN bond force[3] |
| Alignment | — | Face to face alignment[3] |
| Alignment options | — | Bottom side, IR or SmartView alignment[4] |
| Bonding chambers | — | Multiple bonding chambers, up to ten[4] |
| Bonding modes | — | Anodic, thermo-compression or silicon fusion bonding[4] |
| Contact force | — | up to 40 kN[4] |
| Alignment module | — | SmartView®NT Alignment Module with 5x Objectives[3] |
| Bond modules | — | 4 Bond modules[3] |
| Bond force | — | 20 kN bond force[3] |
| Process gas | — | 1 purge gas line for process gas[3] |
| Software | — | EVG CIM Framework Software GUI[3] |
| Loaded features | — | Flexible process flow definition, drag and drop recipe programming, parallel processing of multiple jobs, automated recording of process and machine parameters, throughput optimized handling sequence, password protected user access levels, open cassette loading with empty/present sensor[3] |
| Design | — | Modular design with swap-in modules[4] |
| Cleanroom compatibility | — | Class 1 clean room compatible design[4] |
| Temperature uniformity | — | Excellent temperature uniformity, stability and reproducibility[4] |
| Certification | — | CE Certified[3] |
| Vintage | — | 2014 Vintage[3] |
| Bonding chamber configurations | — | Anodic, thermo-compression or silicon fusion bonding[4] |
| Robot | — | 4 Axis Industrial Robot[3] |
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