Comparison ledger
EV Group 850 LT, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 850 LTEV Group | 10100West Bond |
|---|---|---|
| OEM | EV Group | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Wafer ID Reader | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 850 | West Bond 10100 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | Basic Unit[2] | — |
| Software | EVG CIMFramework (without license)[2] | — |
| Wafer size | Wafer ID Reader[2] | — |
| Model | 850 LT[3] | — |
| OEM | EV Group[3] | — |
| Wafer sizes | 8 inch[2] | — |
| System type | Automated SOI / Direct Wafer Bonding System[1] | — |
| Application focus | SOI substrate manufacturing[1] | — |
| Process steps combined | Cleaning, alignment, pre-bonding, and IR-inspection[1] | — |
| Production mode | High volume production[1] | — |
| Maximum wafer size stated | Up to 300 mm wafers[1] | — |
| Thickness | 300 μm - 800 μm[2] | — |
| Category | Packaging & Bonding[3] | — |
| Automation | Fully-automatic[4] | — |
| Wafer size capability | Up to 300 mm wafers[1] | — |
| Wafer setup thickness | 300 μm - 800 μm[2] | — |
| Wafer ID Reader | Included[2] | — |
| LowTemp plasma activation | Used[1] | — |
| Cleaning module | One Cleaning Module[4] | — |
| Spinner chuck | One Spinner Chuck for 8”/200mm wafers[4] | — |
| DI water dispense line | One DI Water Dispense Line[4] | — |
| LowTemp plasma activation module | One LowTemp Plasma Activation Module[4] | — |
| Control interface | PC controlled with Windows based graphical user interface[4] | — |
| Access control | Password protected access levels[4] | — |
| High frequency RF generator | With matching unit[4] | — |
| Low frequency RF generator | With matching unit[4] | — |
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