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Comparison ledger

Quanta 600 FEGversus0035235-003 MMD Head

FEI Quanta 600 FEG, KLA 0035235-003 MMD Head, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMFEIKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyFEI Quanta 600 FEGKLA 0035235-003 MMD Head
Cited variants
  • Quanta 600 FEG Mark II Environmental Scanning Electron Microscope[1]
—
Specifications
Resolution in ESEM mode1.5 nm[1]—
Operating pressure range6 x 10^-4 Pa to ~1000 Pa[1]—
DetectorSpecial wet STEM detector[1]—
Heating and cooling stage temperature range20-1000°C[1]—
ManipulatorsDual Kleindiek nano-manipulators[1]—
Micro-droplet injection systemIncluded for electrical and mechanical measurements[1]—
Gas injection systemsFor platinum and gold e-beam deposition[1]—
EDSEDAX Energy Dispersive x-ray spectrometer[1]—
EBSDElectron backscatter diffraction detector available[1]—
Resolution (ESEM mode)1.5 nm[1]—
Pressure range6 x 10^-4 Pa to ~1000 Pa[1]—
Temperature range (heating/cooling stages)20-1000°C[1]—
Wet STEM detectorPresent[1]—
Dual Kleindiek nano-manipulatorsPresent[1]—
EDS (Energy Dispersive x-ray spectrometer)EDAX[1]—
EBSD (Electron backscatter diffraction detector)Present[1]—
Instrument typeEnvironmental FEG-SEM[2]—
Electron sourceSchottky field emission (FEG) electron source[2]—
Operating modesHigh-vacuum, low-vacuum, and extended-vacuum modes[2]—
Accelerating voltage200V to 30kV[2]—
Probe currentUp to 100nA continuously adjustable[2]—
Operating pressure, high-vacuum6 × 10−4 Pa[2]—
Operating pressure, low-vacuum10 to 130 Pa[2]—
Operating pressure, ESEM-vacuum10 to 4000 Pa[2]—
DetectorsEverhart-Thornley SED, Low-vacuum SED (LFD), Gaseous SED (GSED), Solid-state BSED, Gaseous BSED, IR-CCD[2]—
EDS systemBruker QUANTAX 400 with XFlash 4010 (10mm2) Silicon Drift Detector (SDD)[2]—
Stage travelX = Y = 150mm, Z = 65mm (Z clearance 93.5mm), Tilt = -5° to +70° degrees, R = 360° continuous[2]—
Compatible stages/modulesHeating stage ~1000°C and Kammrath Weiss tensile module[2]—
Spatial resolution, extended vacuum mode1.5nm at 30kV (SE)[2]—
Wafer size restrictionCan image only center of 4 inch wafer[3]—
Configuration—TSTD PCB ASSY, MMD MEAS HEAD[4]
Model—0035235-003[4]
Make—KLA[4]
Part Description—TSTD PCB ASSY, MMD MEAS HEAD[4]
Compatible System—KLA AIT-XP[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]nano.upenn.edunano.upenn.edu
  2. [2]ncfl.ictas.vt.eduncfl.ictas.vt.edu
  3. [3]nnci.netnnci.net
  4. [4]inventory listing