Comparison ledger
GCA 6300 DSW and GCA AS200, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 6300 DSWGCA | AS200GCA |
|---|---|---|
| OEM | GCA | GCA |
| Category | Lithography | Lithography |
| Wafer size | 150mm | 200mm |
| Process node | 5X g-line wafer stepper | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | g-line | i-line |
| Family | GCA 6300 DSW | GCA AS200 |
| Cited variants | — | |
| Specifications | ||
| Tool type | 5X g-line wafer stepper[1] | — |
| Exposure wavelength | g-line (436 nm)[1] | — |
| Numerical aperture | 0.30 NA[1] | — |
| Reduction ratio | 5:1[1] | — |
| Variable field size | up to 15 mm square[1] | — |
| Minimum feature size | <0.9 µm[1] | — |
| Wafer accommodation | 3" up to 150 mm; smaller pieces[1] | — |
| Registered alignment | <0.25 µm[1] | — |
| Mask size | 5" x 0.090"-thick masks[1] | — |
| Step and repeat exposure system | laser-controlled stage motion[1] | — |
| Lens | Zeiss lens with 0.30 numerical aperture[1] | Tropel i-line Lens[3] |
| Maximum die size | ~15 mm x 15 mm[2] | — |
| Minimum substrate size | ~10 x 10 mm[2] | — |
| Mask plates | 5x5x0.090 inches[2] | — |
| Model | — | AS200[3] |
| OEM | — | GCA[3] |
| Machine name | — | AutoStep 200 DSW i-line Wafer Stepper[3] |
| Reduction | — | 5X[3] |
| Maximum wafer size | — | up to 200 mm wafers[3] |
| Wafer stage | — | 200 mm Wafer Stage[3] |
| Optics NA | — | 0.45 N.A.[3] |
| Exposure field | — | 15 mm[3] |
| Alignment | — | uDFAS Die-by-Die Alignment[3] |
| Illumination | — | Annular and Quadrupole illumination available[3] |
| Feature size specification | — | 0.65 µm features[3] |
| Overlay specification | — | <0.125 µm using local alignment[3] |
| Focus repeatability | — | <0.2 µm[3] |
| Automation | — | All operations are automated, including wafer loading, aligning, reticle loading and aligning[3] |
| Wafer leveling | — | Used to provide optimum focus range[3] |
| Automatic calibrations | — | All tool calibrations are performed automatically[3] |
| Focus compensation | — | Compensated for lens heating and barometric shifts[3] |
| Reticle management | — | Reticle Management System (up to 10 reticles)[3] |
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