GCA

6300 DSW

Lithography 150mm5X g-line wafer stepperg-lineGCA 6300 DSW family

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6300 DSW — cnfusers.cornell.edu — Fig. 016300 DSWcnfusers.cornell.edu^[1]

Wafer size

150mm

Node / era

5X g-line wafer stepper

Performance

<0.25 µm^[1]

Optics

g-line (436 nm)^[1]

What is it?

The Cornell CNF page describes the GCA 6300 DSW as a 5X g-line wafer stepper using a 436 nm lens column with 0.30 NA and 5:1 reduction, variable field size up to 15 mm square, and wafer sizes from 3 inches up to 150 mm plus smaller pieces. The UCSB Nanofab wiki describes a GCA 6300 i-line wafer stepper with 5x reduction, Olympus 2142 optics, and support for piece parts up to 6-inch wafers, but this source does not identify the DSW variant specifically.

What can it run?

Process applications and technology nodes documented for this tool.

photolithography
step and repeat exposure
high-resolution lithography
critical alignment

What do the numbers mean?

Wafer handling4

Tool type: 5X g-line wafer stepper^[1]
Wafer accommodation: 3" up to 150 mm; smaller pieces^[1]
Tool type: i-line wafer stepper^[2]
Minimum substrate size: ~10 x 10 mm^[2]

Optics & imaging8

Exposure wavelength: g-line (436 nm)^[1]
Numerical aperture: 0.30 NA^[1]
Mask size: 5" x 0.090"-thick masks^[1]
Step and repeat exposure system: laser-controlled stage motion^[1]
Lens: Zeiss lens with 0.30 numerical aperture^[1]
Exposure wavelength: i-line (365 nm)^[2]
Lens: Olympus 2142; NA = 0.42^[2]
Mask plates: 5x5x0.090 inches^[2]

Performance1

Registered alignment: <0.25 µm^[1]

Configuration & options5

Reduction ratio: 5:1^[1]
Variable field size: up to 15 mm square^[1]
Minimum feature size: <0.9 µm^[1]
Reduction ratio: 5x^[2]
Maximum die size: ~15 mm x 15 mm^[2]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
GCA 6300 DSW 5X g-line Wafer Stepper	g-line	—	Described as a 5X g-line wafer stepper.	cnfusers.cornell.edu^[1]
GCA 6300 I-Line Wafer Stepper	i-line	—	Described as an i-line wafer stepper with manual wafer loading and up to 6-inch wafers.	wiki.nanofab.ucsb.edu^[2]

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Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

GCA 5X Operation ManualManualcornell.edu
GCA 5X Resist InformationDocumentcornell.edu

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the 6300 DSW are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6300 DSW are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 6300 DSW are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6300 DSW are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No publicly documented compatible parts, consumables, or accessories for the 6300 DSW are on record.
Answerable by: an OEM parts catalog or a service engineer
The operating principle of the 6300 DSW is not documented in this record.
Answerable by: an equipment physicist or OEM application engineer