Comparison ledger
Heller 1088, YES 58 TA HMDS Vacuum Bake Vapor Prime, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1088Heller | |
|---|---|---|
| OEM | Heller | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Heller 1088 | YES 58 |
| Specifications | ||
| Heating Zones | 8 zones (4 top and 4 below) plus 1 cooling zone[1] | — |
| Heating Method | Forced convection[1] | — |
| Conveyor Width | 18 inches (45 cm)[1] | — |
| Heated Length | 43.5 inches (111 cm)[1] | — |
| Overall Length | 96 inches (244 cm)[1] | — |
| Height | 50 inches (127 cm)[1] | — |
| Net Weight | 900 lbs (409 kg)[1] | — |
| Thermal Profiler | Included[1] | — |
| Oven Top | Counter balance for easy access to conveyor[1] | — |
| Solder Compatibility | Lead-free and leaded soldering[1] | — |
| Temperature | — | PID temperature controller, 25–200 °C with front panel readout[2] |
| Configuration | — | Chamber zone controlled for greater temperature uniformity[2] |
| Unit | — | 73.66 cm W × 62.23 cm D × 88.27 cm H (29″ × 24.5″ × 34.75″)[2] |
| Chamber | — | 40.64 cm W × 45.72 cm D × 40.64 cm H (16″ × 18″ × 16″)[2] |
| Capacity | — | 8 cassettes of 125 mm or 150 mm wafers ; 12 cassettes of 100 mm wafers[2] |
| OEM | — | YES[2] |
| Model | — | 58 TA HMDS Vacuum Bake / Vapor Prime Oven[2] |
| Category | — | Thermal / Diffusion[3] |
| Operation temperature | — | Ambient to 180 °C[4] |
| Batch throughput | — | 2 loads/hour vacuum bake/vapor prime; 1 load/hour image reversal[4] |
| Wafer size | — | Up to 300 mm[4] |
| Clean room compatibility | — | Class 10[5] |
| Cleanliness | — | <5 x 1 micron particles per 150 mm wafer[5] |
| Temperature uniformity | — | ±5 °C after stabilization[2] |
| Number of recipes | — | 8 process recipes[5] |
| Process gas inputs | — | 1 N2 vent gas, 1 ammonia, 1 vapor flask[5] |
| Chamber material | — | 316L stainless steel, aluminum door plate[5] |
| Overall system dimensions | — | 73.5 cm W x 62.56 cm D x 88.27 cm H[5] |
| Interior chamber dimensions | — | 40.64 cm W x 45.72 cm D x 40.64 cm H[5] |
| Power requirements | — | 188-253VAC, 50/60Hz, 10 amps[5] |
| Process variables | — | temperature, pressure, and 8 programmable recipes[2] |
| Wafer temperature uniformity | — | ±5 °C after stabilization[2] |
| Operating temperature | — | ambient to 180 °C[2] |
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