58 TA HMDS Vacuum Bake Vapor Prime

The YES 58 TA is a vacuum bake and vapor prime oven for HMDS processing. The YES 58 TA also supports vacuum bake without HMDS and image reversal processing with gaseous ammonia. The YES 58 TA handles wafers up to 300 mm. The YES 58 TA provides batch throughput of 2 loads per hour for vacuum bake and vapor prime, and 1 load per hour for image reversal.^[1][2][3]

The YES 58 TA uses a vacuum bake vapor prime sequence for HMDS application. The YES 58 TA dehydrates substrates under vacuum and then exposes them to HMDS vapor to form an adhesion layer. The YES 58 TA also uses NH3 vapor for image reversal processing. The YES 58 TA includes a PID temperature controller with a 25–200 °C range and front panel readout, a chamber zone control scheme for temperature uniformity, and a state logic controller with touchscreen display. The YES 58 TA includes an MKS Series 902 piezo vacuum gauge with a 0.1–1000 Torr full-scale range, a side-mounted siphon-fill HMDS vessel with a vacuum gauge, vacuum and pressure interlocks, preheated nitrogen, and four diffuser-covered ports to control turbulence during nitrogen cycles.^[1][2][4][5]

Vapor prime ovens generally sit in the lithography track between wafer cleaning or dehydration preparation and photoresist coating. Vacuum bake and HMDS prime are generally used before resist coat to improve adhesion on oxide and other moisture-sensitive surfaces. Image reversal operation generally occurs within a photolithography sequence after resist coating and exposure, before development.

The YES 58 TA supports image reversal bake, vapor prime, and vacuum bake. The YES 58 TA is designed for promoting photoresist adhesion. The YES 58 TA is compatible with silicon, gallium arsenide, lithium niobite, and other substrate materials.^[2][5]