Comparison ledger
KLA 0035235-003 MMD Head, Koh Young KY8030-2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | KY8030-2Koh Young | |
|---|---|---|
| OEM | KLA | Koh Young |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Koh Young KY8030-2 |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Manufacturer | — | Koh Young[2] |
| Product category | — | Solder Paste Inspection System (SPI)[2] |
| Product type | — | 3D solder paste inspection system (SPI)[3] |
| Measured quantities | — | Paste height, area, and volume[3] |
| Inspection speed | — | 11.1 to 59.5 cm²/sec[3] |
| Field of view | — | 20x20 to 50x50 millimetres[3] |
| Resolution | — | 10, 15, 20, or 25 microns[3] |
| Formats | — | M, L, and XL[3] |
| Z resolution | — | 0.37 microns[3] |
| Height accuracy | — | 1 micron[3] |
| Gage R&R | — | Under 10 percent at 6 sigma against a ±50 percent tolerance[3] |
| Maximum paste height | — | 450 microns[3] |
| Optional dispensing | — | Automated solder paste dispensing as an optional add-on[3] |
| Warp compensation | — | Active warp compensation[3] |
| Technology | — | Patented 3D dual-inspection Moiré projection technology[3] |
| Illumination | — | IR-RGB LED dome styled illumination[4] |
| Operating system | — | Windows 10 IoT Enterprise LTSC 2019[4] |
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