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Koh Young

KY8030-2

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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The KY8030-2 is a solder paste inspection system (SPI) in Koh Young's product lineup. The KY8030-2 belongs to Koh Young's Solder Paste Inspection System (SPI) solution group.[1]

Koh YoungKY8030-2
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  • Plate 01KOHYOUNG KY8030-2 SPI Machine High-Speed 3D Solder Paste Inspection

    GOLDLAND SMT EQUIPMENTWatch on YouTube
  • Plate 02ID#112306 (KY8030-2 SOLDER PASTE INSPECTION, KOH YOUNG

    Kalani RevierWatch on YouTube
  • Plate 03KohYoung KY8030-2 3D SPI SMT Machine – Precision Solder Paste Inspection for PCB Production

    GOLDLAND SMT EQUIPMENTWatch on YouTube

Performance

1 micron[2]

Optics

10, 15, 20, or 25 microns[2]

What it is

General reference — not yet source-verified

Solder paste inspection systems are metrology and inspection tools used in electronics assembly to verify deposited solder paste on printed circuit boards before component placement. Such systems check whether printed deposits match the intended pattern so that printing defects can be found before later assembly steps add components and solder the board.

How it works

General reference — not yet source-verified

Solder paste inspection systems generally image each printed deposit and convert the measurement into quantitative data for process control. True three dimensional systems in this class are used to evaluate deposit geometry rather than relying only on two dimensional appearance, which helps separate cosmetic variation from volume or height errors.

Where it fits in the process flow

General reference — not yet source-verified

Solder paste inspection sits after stencil printing and before component placement in a surface-mount assembly line. The purpose of that position is to catch paste defects early, when correction is easier and before placement and reflow can turn printing errors into assembly defects.

Applications

General reference — not yet source-verified

Solder paste inspection is used across electronics manufacturing for printed circuit boards and electronic assemblies. The process is used to identify defects such as insufficient solder, excessive solder, misalignment, and shape discrepancies before parts are mounted.

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Eliminates shadow and specular reflection challenges.

What do the numbers mean?

Optics & imaging3

Resolution
10, 15, 20, or 25 microns[2]
Accurate?
Z resolution
0.37 microns[2]
Accurate?
Illumination
IR-RGB LED dome styled illumination[3]
Accurate?

Performance1

Height accuracy
1 micron[2]
Accurate?

Control & software1

Operating system
Windows 10 IoT Enterprise LTSC 2019[3]
Accurate?

Dimensions & facilities2

Measured quantities
Paste height, area, and volume[2]
Accurate?
Maximum paste height
450 microns[2]
Accurate?

Configuration & options10

Manufacturer
Koh Young[1]
Accurate?
Product category
Solder Paste Inspection System (SPI)[1]
Accurate?
Product type
3D solder paste inspection system (SPI)[2]
Accurate?
Inspection speed
11.1 to 59.5 cm²/sec[2]
Accurate?
Field of view
20x20 to 50x50 millimetres[2]
Accurate?
Formats
M, L, and XL[2]
Accurate?
Gage R&R
Under 10 percent at 6 sigma against a ±50 percent tolerance[2]
Accurate?
Optional dispensing
Automated solder paste dispensing as an optional add-on[2]
Accurate?
Warp compensation
Active warp compensation[2]
Accurate?
Technology
Patented 3D dual-inspection Moiré projection technology[2]
Accurate?
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What replaced it?

  • siblingKoh Young KY8030-3— Listed in the same Solder Paste Inspection System (SPI) product group as the KY8030-2.source[1]
  • siblingKoh Young KY8080— Listed in the same Solder Paste Inspection System (SPI) product group as the KY8030-2.source[1]
  • siblingKoh Young aSPIre 3— Listed in the same Solder Paste Inspection System (SPI) product group as the KY8030-2.source[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What type of equipment is the KY8030-2?

The KY8030-2 is a True 3D solder paste inspection system in Koh Young’s SPI product line.[1][2]

What does the KY8030-2 measure?

The KY8030-2 measures solder paste height, area, and volume.[2]

Does the KY8030-2 offer any rework-related option?

The KY8030-2 offers an optional Auto-Rework solution that dispenses solder paste automatically.[2][3]

Not publicly documented

The following facts about the KY8030-2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the KY8030-2 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the KY8030-2 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the KY8030-2 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the KY8030-2 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the KY8030-2 are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]kohyoung.com — kohyoung.comkohyoung.com
  2. [2]kohyoungamerica.com — kohyoungamerica.comkohyoungamerica.com
  3. [3]alpha-electronic.net — alpha-electronic.netalpha-electronic.net
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Last updated Oct 19, 2026.

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