Comparison ledger
KLA 0035235-003 MMD Head, Onto Innovation Nanospec AFT Metrology, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Nanospec AFT MetrologyOnto Innovation | |
|---|---|---|
| OEM | KLA | Onto Innovation |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Onto Innovation Nanospec AFT Metrology |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | Nanospec AFT[2] |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Manufacturer | — | Onto Innovation[2] |
| Category | — | Metrology & Inspection[3] |
| Measurement method | — | Reflectometry[4] |
| Measurement target | — | Thickness of transparent thin films on silicon wafers[4] |
| Wafer diameters | — | 100 mm, 150 mm[5] |
| Wafer materials | — | silicon[5] |
| Wafer holder | — | delrin[5] |
| Wafer thickness | — | 200 .. 1000 µm[5] |
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