Comparison ledger
KLA 0035235-003 MMD Head, Onto Innovation NSX, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NSXOnto Innovation | |
|---|---|---|
| OEM | KLA | Onto Innovation |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Onto Innovation NSX |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| System type | — | 2D defect inspection plus metrology system[2] |
| Throughput | — | high throughput[2] |
| Wafer size | — | 100mm to 330mm[2] |
| Inspection modes | — | 2D inspection and metrology; optional 3D metrology integration[2] |
| Automation | — | high-acceleration staging[2] |
| Computing | — | high-speed multi-processor computing[2] |
| Software | — | flexible software[2] |
| 3D sensors | — | broad portfolio of 3D sensors[2] |
| Edge/backside inspection | — | optional via EB40 module[2] |
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