NSX

Inspection and metrology systems of this class are used to examine wafers or related substrates for visible surface defects and process-related abnormalities. Such tools generally support inline process control by finding excursions early and by organizing inspection results for review and disposition.

Automated visual inspection systems of this class move the substrate under controlled optics and illumination while image-processing software searches for features that depart from a learned or expected background. Metrology-capable variants in this class may combine defect detection with dimensional or topography measurements so that inspection and measurement data can be correlated within one workflow.

Automated visual inspection tools of this class are typically placed after patterning, deposition, plating, etch, bond, singulation-adjacent, or test-adjacent steps where rapid screening for visible defects is needed. Such tools help determine whether material should proceed to review, rework, additional metrology, or the next manufacturing operation.

The NSX 330 system offers advanced macro inspection for a wide range of defect sizes at high throughput, with optional 3D metrology integration. The NSX 330 system offers 2D inspection and metrology at high throughput and supports critical advanced packaging applications. The NSX 330 system supports wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via in a single wafer load. The NSX 330 system can inspect whole wafers and film frames, and it is also used for gel and waffle pack inspection, OQA, post saw work, and post probe and testing. The NSX 330 system also addresses substrate thickness, TTV, bonded wafer thickness, stack thickness, via depth, RST, bow, and warp. The NSX 330 system accommodates wafers from 100 mm to 330 mm. The NSX 330 system can be configured with optional edge and backside inspection through the EB40 module.^[1]