Comparison ledger
KLA 0035235-003 MMD Head, Toho Technology FLX-2320-S, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | FLX-2320-SToho Technology | |
|---|---|---|
| OEM | KLA | Toho Technology |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Toho Technology FLX-2320-S |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Measurement principle | — | Measures the change in the radius of curvature of a wafer or substrate caused by deposition of a stressed thin film.[2] |
| Use case | — | Thin-film stress measurement.[2] |
| Function | — | Measures the change in the radius of curvature of a wafer or substrate caused by the deposition of a stressed thin film.[2] |
| Stress calculation method | — | Uses Stoney’s equation / the Stoney relationship[3] |
| Temperature range | — | Room temperature to 500°C; optional -65°C to room temperature[4] |
| Heating rate | — | Up to 30°C per minute[4] |
| Wafer sizes | — | 50 mm (optional), 75 mm, 100 mm, 125 mm, 150 mm, and 200 mm[3] |
| Scan range | — | User programmable up to 200 mm[3] |
| Minimum scan step | — | 0.02 mm[3] |
| Maximum points per scan | — | 1250[3] |
| Measurement speed | — | 6 seconds per wafer[3] |
| Measurement range | — | 1 x 10^7 to 4 x 10^10 dyne/cm²[3] |
| Repeatability | — | 1 x 10^7 dyne/cm²[3] |
| Accuracy | — | Less than 2.5% or 1 MPa, whichever is larger[3] |
| Minimum radius | — | 2.0 m[3] |
| Maximum radius | — | 33 km[4] |
| Laser wavelengths | — | 670 nm and 780 nm[3] |
| Laser power | — | 4 mW[3] |
| Compliance | — | Class IIIa laser at 670 nm and Class IIIb laser at 780 nm compliant with 21 CFR, Chapter 1, Subchapter J[3] |
| Analysis software platform | — | Windows 11 based analysis software[4] |
| Physical characteristics | — | Measurement module height 46 cm, depth 46 cm, width 56 cm, weight 45.5 kg[3] |
| Power requirements | — | Measurement module 200-240 VAC, 50/60 Hz, 13 A; computer 115 VAC, 50/60 Hz, 5.4 A[3] |
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