Toho Technology
FLX-2320-S
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Plate 01KLA-Tencor FLX-2320 Film Stress Measurement System (ID# 4344)
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What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Thin-film stress measurement
What do the numbers mean?
Wafer handling1
- Measurement principle
- Measures the change in the radius of curvature of a wafer or substrate caused by deposition of a stressed thin film.[1]
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does the FLX-2320-S measure?
It measures the change in the radius of curvature of a wafer or substrate caused by deposition of a stressed thin film.[1]
What does the instrument calculate from that measurement?
It is used to determine thin-film stress using the substrate's biaxial elastic modulus, substrate thickness, film thickness, and radius of curvature.[1]
When must the radius be measured?
The radius has to be measured before and after the deposition.[1]
What is one stated use of the calculator provided with the system page?
It can be used to calculate the film thickness required to correct the bow of a substrate.[1]
Not publicly documented
The following facts about the FLX-2320-S are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the FLX-2320-S are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FLX-2320-S are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FLX-2320-S are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FLX-2320-S are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FLX-2320-S are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
Last updated Jul 29, 2026.
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