FLX-2320-S

The Toho Technology FLX-2320-S is a thin film stress measurement system. The Toho Technology FLX-2320-S measures the change in the radius of curvature of a wafer or substrate caused by the deposition of a stressed thin film. The Toho Technology FLX-2320-S is offered for stress measurements on films and substrates up to 200 mm in diameter. The Toho Technology FLX-2320-S is configured as a tabletop system.^{[1][2][5][6][3]}

The Toho Technology FLX-2320-S determines stress by measuring substrate curvature before film deposition and again after deposition. The Toho Technology FLX-2320-S uses the difference between the pre-deposition and post-deposition curvature to calculate stress with Stoney’s equation. The Toho Technology FLX-2320-S measures curvature by directing a laser at the wafer surface and detecting the reflected beam with a position-sensitive photodiode. The Toho Technology FLX-2320-S records surface geometry by scanning across the wafer.^[1][2]

The Toho Technology FLX-2320-S incorporates dual wavelength technology. The Toho Technology FLX-2320-S can select the wavelength most suitable for a given film, including transparent films such as silicon nitride. The Toho Technology FLX-2320-S provides in-situ stress measurement for thermal stress work from -65°C to 500°C, with heating rates up to 30°C per minute. The Toho Technology FLX-2320-S has optional cooling capability to -65°C and can support controlled atmospheres with nitrogen or argon inert flush capability.^[2][6][3]

Thin film stress measurement tools are metrology instruments used around deposition and thermal processing steps. Thin film stress measurement tools are typically used after a baseline substrate measurement and then again after film formation to quantify how the added layer changes wafer bow or curvature. Thin film stress measurement helps connect deposition conditions and thermal history to mechanical behavior in the film stack.

The Toho Technology FLX-2320-S is used to investigate stress-related process problems such as metal and dielectric film cracking, voiding, and lifting formation. The Toho Technology FLX-2320-S is used for stress-temperature correlation work and for characterizing stress relaxation, moisture evolution, and phase changes. The Toho Technology FLX-2320-S includes analysis functions for stress uniformity, wafer topography views, and stress-temperature plotting.^[2][6][3]