Comparison ledger
KLA .204 PSL Wafer, Koh Young KY 8030 2 3D, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | KY 8030 2 3DKoh Young | |
|---|---|---|
| OEM | KLA | Koh Young |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA .204 PSL Wafer | Koh Young KY 8030 2 3D |
| Specifications | ||
| Configuration | NIST Traceable[1] | — |
| Wafer Size | 8 inch[2] | — |
| Traceability | NIST[3] | — |
| Compatible Tools | Surfscan 6xy0, Sp1[1] | — |
| NIST Traceable | Yes[2] | — |
| Compatible tools | Surfscan 6xy0 and Sp1 particle counters[2] | — |
| Inspection Range | — | 01005[4] |
| PCB Size (standard) | — | 490 x 510 mm[4] |
| Machine Dimensions | — | 1000 x 1280 x 1727 mm[4] |
| Weight | — | 600 kg[4] |
| Inspection Items | — | Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity[4] |
| Inspection Speed (per FOV) | — | 0.47 sec (for 15/20/25 µm resolution)[4] |
| Maximum PCB Size (M/L/XL) | — | 330x250 mm / 510x510 mm / 810x610 mm[4] |
| FOV Size | — | 30 x 30 mm[4] |
| 3D Inspection Speed | — | 22.5 – 56.1 cm²/s[4] |
| Distance between Deposits | — | 100 µm[4] |
| Inspection Size | — | 10 x 10 mm[4] |
| Inspection Height | — | 400 µm[4] |
| Power Supply | — | Single phase 200-240 VAC, 50-60 Hz[4] |
| Air Supply | — | 5 kgf/cm²[4] |
| Technology | — | Patented dual projection Moiré technology for shadow-free 3D inspection[4] |
| OEM | — | Koh Young[5] |
| Model | — | KY 8030 2[5] |
| Tool family | — | Koh Young KY 8030 2 3D[6] |
| Machine type | — | full 3D solder paste inspection (SPI) machine[6] |
| Measurement technology | — | patented dual projection Moiré technology[6] |
| Measurement characteristic | — | shadow-free measurement[6] |
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