Koh Young

KY 8030 2 3D

Metrology & Inspection Koh Young KY 8030 2 3D family

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The Koh Young KY 8030 2 3D is a full 3D solder paste inspection machine. The Koh Young KY 8030 2 3D uses patented dual projection Moiré technology for shadow-free measurement.^[1]

KY 8030 2 3D — Inventory photo — Fig. 01KY 8030 2 3DInventory photo^[2]

Power

Single phase 200-240 VAC, 50-60 Hz^[3]

Optics

0.47 sec (for 15/20/25 µm resolution)^[3]

What it is

The Koh Young KY 8030 2 3D is a solder paste inspection machine. The Koh Young KY 8030 2 3D is categorized in metrology and inspection. The Koh Young KY 8030 2, also designated KY8030-2, is a full 3D solder paste inspection machine.^[1]^[2]^[4]

How it works

General reference — not yet source-verified

A solder paste inspection system measures deposited paste on printed circuit boards after stencil printing. A solder paste inspection system typically builds height data across each printed deposit and compares the measured result with programmed criteria for print quality. A solder paste inspection system is used to detect print defects before component placement and reflow. A full three dimensional inspection approach is used to evaluate paste shape rather than relying only on planar image contrast.

Where it fits in the process flow

General reference — not yet source-verified

A solder paste inspection machine is placed after solder paste printing and before component placement in an SMT line. A solder paste inspection machine provides feedback on print quality at the stage where insufficient, excessive, shifted, or malformed deposits can still be corrected before assembly continues. A metrology and inspection tool at this point helps separate printing issues from later placement or reflow issues during process troubleshooting.

Applications

General reference — not yet source-verified

Solder paste inspection is used in surface mount electronics manufacturing to verify stencil printing results on circuit boards. Solder paste inspection supports process control for assemblies that depend on consistent paste deposit geometry for later component attach quality. Solder paste inspection is relevant wherever printed solder deposits must be checked for completeness, alignment, and shape before the board moves to placement and soldering.

What do the numbers mean?

Power & electrical1

Power Supply: Single phase 200-240 VAC, 50-60 Hz^[3]

Optics & imaging1

Inspection Speed (per FOV): 0.47 sec (for 15/20/25 µm resolution)^[3]

Dimensions & facilities4

Machine Dimensions: 1000 x 1280 x 1727 mm^[3]
Weight: 600 kg^[3]
Inspection Items: Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity^[3]
Inspection Height: 400 µm^[3]

Configuration & options15

Inspection Range: 01005^[3]
PCB Size (standard): 490 x 510 mm^[3]
Maximum PCB Size (M/L/XL): 330x250 mm / 510x510 mm / 810x610 mm^[3]
FOV Size: 30 x 30 mm^[3]
3D Inspection Speed: 22.5 – 56.1 cm²/s^[3]
Distance between Deposits: 100 µm^[3]
Inspection Size: 10 x 10 mm^[3]
Air Supply: 5 kgf/cm²^[3]
Technology: Patented dual projection Moiré technology for shadow-free 3D inspection^[3]
OEM: Koh Young^[2]
Model: KY 8030 2^[2]
Tool family: Koh Young KY 8030 2 3D^[1]
Machine type: full 3D solder paste inspection (SPI) machine^[1]
Measurement technology: patented dual projection Moiré technology^[1]
Measurement characteristic: shadow-free measurement^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Power SupplySingle phase 200-240 VAC, 50-60 Hz^[3]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the Koh Young KY 8030 2 3D?

The Koh Young KY 8030 2 3D is a full 3D solder paste inspection machine.^[1]^[2]^[4]

What measurement technology does the Koh Young KY 8030 2 use?

The Koh Young KY 8030 2 uses patented dual projection Moiré technology for shadow-free measurement.^[1]

Not publicly documented

The following facts about the KY 8030 2 3D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the KY 8030 2 3D are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the KY 8030 2 3D are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the KY 8030 2 3D are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the KY 8030 2 3D are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the KY 8030 2 3D is not on record.
Answerable by: an OEM datasheet or a fab qualification report