Comparison ledger
KLA 2132 and KLA D600, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2132KLA | D600KLA |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | 2" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | D-series |
| Family | KLA 2132 | KLA D600 |
| Specifications | ||
| Product type | Wafer inspection system[1] | — |
| Relationship to KLA 2135 | Earlier model than the KLA 2135[1] | — |
| Wafer size (primary) | 200mm (8")[2] | — |
| Wafer size (alternate) | 4", 5", 6" capable[2] | — |
| Throughput | 2–8 wafers per hour[2] | — |
| Sensitivity | >0.25 µm pixels[2] | — |
| Inspection type | Patterned wafer defect inspection[2] | — |
| Optics | Brightfield, small-pixel, high data rate digital image processing[1] | — |
| User interface | DOS operating system[3] | — |
| SAT capability | Segmented Auto Threshold (SAT) included[2] | — |
| Calibration wafer | 8" DSW calibration wafer included[2] | — |
| Vintage (year of introduction) | 1995[2] | — |
| Instrument type | — | Stylus surface profiler[4] |
| Measurement purpose | — | Thin and thick film step height measurement[4] |
| Wafer compatibility | — | 2", 4", 6", and 8" wafers[4] |
| Field of view | — | 3780 x 3120 um[4] |
| Digital zoom | — | x4[4] |
| Scan length range | — | 55 mm with stitching option[4] |
| Vertical range | — | 1 mm[4] |
| Step-height repeatability | — | 5A[4] |
| Force range | — | 0.03 to 15 mg[4] |
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