Comparison ledger
KLA 2138 and KLA D600, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2138KLA | D600KLA |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | 2" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | D-series |
| Family | KLA 2138 | KLA D600 |
| Specifications | ||
| Product name | KLA-2138[1] | — |
| Type | Wafer Inspection System[1] | — |
| Technology | Ultra-Broadband Technology[1] | — |
| Illumination source | Ultra-broadband (UBB) illumination source[1] | — |
| Optics | Significantly improved brightfield optics[1] | — |
| Detection technology | Segmented Auto Threshold (SAT) technology[1] | — |
| Optional configuration | Integrated SMIF minienvironment[1] | — |
| Instrument type | — | Stylus surface profiler[2] |
| Measurement purpose | — | Thin and thick film step height measurement[2] |
| Wafer compatibility | — | 2", 4", 6", and 8" wafers[2] |
| Field of view | — | 3780 x 3120 um[2] |
| Digital zoom | — | x4[2] |
| Scan length range | — | 55 mm with stitching option[2] |
| Vertical range | — | 1 mm[2] |
| Step-height repeatability | — | 5A[2] |
| Force range | — | 0.03 to 15 mg[2] |
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