Comparison ledger
KLA 2351 and KLA Alpha Step D 300 Stylus, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2351KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | Wafer Transfer System | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2351 | KLA Alpha Step |
| Specifications | ||
| Configuration | With HDD & Software[1] | Issue with the style module[3] |
| Load Port Qty | 2[1] | — |
| Wavelength Illumination | 370~720 nm[1] | — |
| Wavelength Band | Visible, UV[1] | — |
| Pixel Size | 0.16μm / 0.20μm / 0.25μm / 0.39μm / 0.62μm[1] | — |
| Array Defect Capture Rate | ≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[1] | — |
| Array False Defect Rate | ≤1.5%(all sizes)[1] | — |
| Random Defect Capture Rate | ≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[1] | — |
| Random False Defect Rate | ≤1.5% (all sizes)[1] | — |
| Repeatability | ≥90% (20 consecutive run on the same DSW wafer)[1] | — |
| Wafer size | Wafer Transfer System[1] | — |
| Instrument type | — | Stylus-based surface profiler[4] |
| Stylus tip radius | — | 2 µm[4] |
| Step height measurement range | — | 50 nm to 300 µm[4] |
| Measurement principle | — | Stylus placed in contact with and dragged along the substrate surface; vertical deflection measures change in step height[4] |
| Supported substrate types | — | Silicon, Silicon Germanium, Quartz, Sapphire, Glass, Germanium, Silicon Carbide, Gallium Nitride, III-V, Gallium Arsenide, Polymer, Carbon Polymer Based, Lithium Niobate[4] |
| Supported substrate sizes | — | Pieces, 2 inch, 3 inch, 4 inch, 6 inch wafer[4] |
| Maximum load | — | 1[4] |
| Cleanliness | — | Flexible[4] |
| Stylus scan distance used in roughness testing | — | 3 mm[5] |
| Manufacturer location | — | KLA-Tencor Corporation, Milpitas, CA[5] |
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