Waferpedia

Comparison ledger

2351 versus P-17

KLA 2351 and KLA P-17, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
2351KLA
P-17KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer sizeWafer Transfer System
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyKLA 2351KLA P-17
Cited variants
  • Tencor P-17 OF (Open Frame)[1]
Specifications
ConfigurationWith HDD & Software[2]
Load Port Qty2[2]
Wavelength Illumination370~720 nm[2]
Wavelength BandVisible, UV[2]
Pixel Size0.16μm / 0.20μm / 0.25μm / 0.39μm / 0.62μm[2]
Array Defect Capture Rate≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[2]
Array False Defect Rate≤1.5%(all sizes)[2]
Random Defect Capture Rate≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[2]
Random False Defect Rate≤1.5% (all sizes)[2]
Repeatability≥90% (20 consecutive run on the same DSW wafer)[2]
Wafer sizeWafer Transfer System[2]
Instrument typeMechanical profilometer[4]
Z range1 mm[4]
Vertical resolution0.6 Å[4]
Lateral resolution0.5 µm[4]
Step height rangeNanometers to 1000 µm[1]
Constant force control0.03 to 50 mg[1]
Scan length (without stitching)200 mm[1]
Video camera5 MP high-resolution color[1]
Stylus tip radius options40 nm to 50 µm[5]
Stylus included angle options20 to 100 degrees[5]
Sample chuck range50 to 200 mm[1]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]kla.comkla.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]epfl.chepfl.ch
  5. [5]kla.comkla.com