Waferpedia

Comparison ledger

Alpha Step D 300 Stylus versus D600

KLA Alpha Step D 300 Stylus and KLA D600, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
D600KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size2"
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
GenerationD-series
FamilyKLA Alpha StepKLA D600
Specifications
ConfigurationIssue with the style module[1]
Instrument typeStylus-based surface profiler[2]Stylus surface profiler[4]
Stylus tip radius2 µm[2]
Step height measurement range50 nm to 300 µm[2]
Measurement principleStylus placed in contact with and dragged along the substrate surface; vertical deflection measures change in step height[2]
Supported substrate typesSilicon, Silicon Germanium, Quartz, Sapphire, Glass, Germanium, Silicon Carbide, Gallium Nitride, III-V, Gallium Arsenide, Polymer, Carbon Polymer Based, Lithium Niobate[2]
Supported substrate sizesPieces, 2 inch, 3 inch, 4 inch, 6 inch wafer[2]
Maximum load1[2]
CleanlinessFlexible[2]
Stylus scan distance used in roughness testing3 mm[3]
Manufacturer locationKLA-Tencor Corporation, Milpitas, CA[3]
Measurement purposeThin and thick film step height measurement[4]
Wafer compatibility2", 4", 6", and 8" wafers[4]
Field of view3780 x 3120 um[4]
Digital zoomx4[4]
Scan length range55 mm with stitching option[4]
Vertical range1 mm[4]
Step-height repeatability5A[4]
Force range0.03 to 15 mg[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]snfguide.stanford.edusnfguide.stanford.edu
  3. [3]frontiersin.orgfrontiersin.org
  4. [4]epfl.chepfl.ch