Waferpedia

Comparison ledger

Candela CS 20 V versus D600

KLA Candela CS 20 V and KLA D600, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
D600KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size2"
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
GenerationD-series
FamilyKLA Candela CS 20KLA D600
Specifications
Voltage230 VAC[1]
Configuration50/60 Hz[1]
Phase3 Phase[1]
Chuck2-5"[2]
Wafer sizes4-inch and 6-inch[3]
Chuck sizes4-inch and 6-inch[3]
Software vsCandela Wafer Version 6.8 Build 16[3]
Laser specs405 nm oblique-incidence laser and 660 nm normal-incidence laser[3]
Instrument typeStylus surface profiler[4]
Measurement purposeThin and thick film step height measurement[4]
Wafer compatibility2", 4", 6", and 8" wafers[4]
Field of view3780 x 3120 um[4]
Digital zoomx4[4]
Scan length range55 mm with stitching option[4]
Vertical range1 mm[4]
Step-height repeatability5A[4]
Force range0.03 to 15 mg[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]epfl.chepfl.ch