Waferpedia

Comparison ledger

D600 versus P-17

KLA D600 and KLA P-17, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
D600KLA
P-17KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size2"
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
GenerationD-series
FamilyKLA D600KLA P-17
Cited variants
  • Tencor P-17 OF (Open Frame)[1]
Specifications
Instrument typeStylus surface profiler[2]Mechanical profilometer[3]
Measurement purposeThin and thick film step height measurement[2]
Wafer compatibility2", 4", 6", and 8" wafers[2]
Field of view3780 x 3120 um[2]
Digital zoomx4[2]
Scan length range55 mm with stitching option[2]
Vertical range1 mm[2]
Step-height repeatability5A[2]
Force range0.03 to 15 mg[2]
Z range1 mm[3]
Vertical resolution0.6 Å[3]
Lateral resolution0.5 µm[3]
Step height rangeNanometers to 1000 µm[1]
Constant force control0.03 to 50 mg[1]
Scan length (without stitching)200 mm[1]
Video camera5 MP high-resolution color[1]
Stylus tip radius options40 nm to 50 µm[4]
Stylus included angle options20 to 100 degrees[4]
Sample chuck range50 to 200 mm[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]kla.comkla.com
  2. [2]epfl.chepfl.ch
  3. [3]epfl.chepfl.ch
  4. [4]kla.comkla.com