Waferpedia

Comparison ledger

D600 versus P-7

KLA D600 and KLA P-7, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
D600KLA
P-7KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size2"
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
GenerationD-series
FamilyKLA D600KLA P-7
Specifications
Instrument typeStylus surface profiler[1]
Measurement purposeThin and thick film step height measurement[1]
Wafer compatibility2", 4", 6", and 8" wafers[1]
Field of view3780 x 3120 um[1]
Digital zoomx4[1]
Scan length range55 mm with stitching option[1]
Vertical range1 mm[1]
Step-height repeatability5A[1]
Force range0.03 to 15 mg[1]
equipment typeStylus profilometer[2]
equipment type categoryTopographical Metrology[3]
equipment name as listedStep Profilometer (KLA Tencor P-7)[3]
Step Height RangeNanometers to 1000 µm[4]
Stylus Tip Radius2 µm[5]
Stylus Bevel60°[5]
Max Scan Length150 mm[6]
Vertical Range1 mm[6]
Sample SizeUp to 150 mm[6]
Sampling RateHigher sampling rates increase data resolution, but can introduce noise above 200 Hz[5]
Applied Force0.03 to 50 mg[4]
Stylus MaterialDiamond[4]

Plan your fab

Building a Metrology & Inspection process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]tmi.utexas.edutmi.utexas.edu
  3. [3]wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
  4. [4]kla.comkla.com
  5. [5]research.yale.eduresearch.yale.edu
  6. [6]pnf.uchicago.edupnf.uchicago.edu