Waferpedia

Comparison ledger

P 16 +versusP 22 Surface

KLA P 16 +, KLA P 22 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA P 16 +KLA P
Specifications
Phase1 Phase[1]—
Configuration2A, 20in Hg @ 1cfm[1]UPI Board Only[3]
Software(OS) version 7.31.05 [Build 5][1]—
Tool typeStylus profilometer[2]—
Measurement typeStep height, roughness, waviness, stress[2]—
Vertical range327 µm[2]—
Wafer sizes2, 3, 4, 5, 6, 8, 12 inch[2]—
StageFully motorized X-Y, Z, theta, and level stage[2]—
Stylus2 µm / 60D[2]—
Operating systemWindows XP[2]—
ApplicationsCMP monitoring and bump metrology[2]—
Manufacturer—KLA[3]
Model—P 22 Surface[4]
Equipment type—surface profilometer[3]
Category—Metrology & Inspection[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing