Comparison ledger
Lam Research 2300 e 5 Kiyo, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300 e 5 KiyoLam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 3 Chamber + 1 Strip[2] | — |
| Loadport | TDK TAS300[2] | — |
| ATM Robot | Kawasaki P/N 3NT510B-A002[2] | — |
| TM Robot | Brooks 201600-294-0002[2] | — |
| MKS E28D-29237 Process Vacuum Gauge | 0.1 Torr[2] | — |
| MKS 625D-30518 Chamber Vacuum Gauge | 1 Torr[2] | — |
| Number of Chambers | 3 Chamber + 1 Strip[2] | — |
| Turbo Pump | Edwards STP-XA3203CV[2] | — |
| Turbo Pump Controller | Edwards SCU-1600[2] | — |
| Bias RF Generator | Lam 3156110-214[2] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[3] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[3] |
| Physical description | — | compact[1] |
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