Comparison ledger
Lam Research AutoEtch 490, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AutoEtch 490Lam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research AutoEtch 490 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Poly[2] | — |
| OEM | Lam Research[3] | — |
| Model | AutoEtch 490[4] | — |
| Category | Plasma Etch[3] | — |
| Wafer Sizes | 6 inch[2] | — |
| Wafer Size Capability | 4, 5, 6 inch capability[3] | — |
| Process Type | in-line, cassette to cassette, fully automated, single wafer, double air-locked, parallel plate plasma etching system[3] | — |
| Applications | Polysilicon, Silicon Nitride, Refractory metal silicides, Thin dielectrics[5] | — |
| Chemistries | chlorine and Freon chemistries[5] | — |
| Wafer size capability | 4, 5, 6 inch[3] | — |
| Process type | Plasma etch[3] | — |
| Chamber configuration | Parallel plate, double air-locked[3] | — |
| Wafer transfer | Cassette-to-cassette, fully automated[3] | — |
| Process control | Automatic, closed-loop feedback control; double keylocked[3] | — |
| Operator interface | CRT monitor display[3] | — |
| Gas handling | Gas panel regulates up to five gases; capacity for six[3] | — |
| Chemistry compatibility | Chlorine and Freon[5] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[6] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[6] |
| Physical description | — | compact[1] |
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