Lam Research
AutoEtch 490
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
The AutoEtch 490 uses a recipe-based control approach for process settings such as pressure, RF power, electrode spacing, gas flow, and step termination.[2]
Where it fits in the process flow
General reference — not yet source-verifiedThe AutoEtch 490 sits in the wafer pattern-transfer stage of the line, where patterned films are etched after mask-defined exposure has opened the target areas.
The AutoEtch 490 is used for front-end thin-film patterning rather than final assembly steps.
Applications
What do the numbers mean?
Wafer handling5
- Process Type
- in-line, cassette to cassette, fully automated, single wafer, double air-locked, parallel plate plasma etching system[2]
Gas & chemistry3
Control & software2
Configuration & options7
- Poly[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes can the AutoEtch 490 handle?
The AutoEtch 490 has 4-inch, 5-inch, and 6-inch capability.[2]
What chemistries does the AutoEtch 490 accommodate?
The AutoEtch 490 accommodates chlorine and Freon chemistries.[4]
What process variables are programmable on the AutoEtch 490?
The AutoEtch 490 has programmable operating pressure, RF power, electrode spacing, gas flow rates, and step terminating modes.[2]
Not publicly documented
The following facts about the AutoEtch 490 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AutoEtch 490 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AutoEtch 490 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AutoEtch 490 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AutoEtch 490 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AutoEtch 490 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]semistarcorp.com — semistarcorp.comsemistarcorp.com
- [3]Equipment inventory listing
- [4]cdn2.hubspot.net — cdn2.hubspot.netcdn2.hubspot.net
- [5]Lam Research Autoetch 490 Plasma Etcher System — spwindustrial.comspwindustrial.com
Last updated Oct 13, 2026.
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