Comparison ledger
Lam Research TCP 9400 SE, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | TCP 9400 SELam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research TCP 9400 SE | Tegal 110 |
| Cited variants |
| |
| Specifications | ||
| Software Revision | E1.6.1-002[4] | — |
| Main UI PN | PC NEXT 33[4] | — |
| ESC | 718-094523-281[4] | — |
| Liner | 715-030329-002[4] | — |
| GAZ Box Réf | 853-024403-104[4] | — |
| Platform | Rainbow[5] | — |
| Source type | Inductively coupled (TCP)[5] | — |
| Wafer size | 200 mm (8 inch)[4] | — |
| Chamber configuration | Single chamber[5] | — |
| Wafer transport | Cassette to cassette[5] | — |
| Vacuum pump | Leybold TURBOVAC 1000C[1] | — |
| Software version | Envision version 1.4[1] | — |
| End point detection | Emission and interferometric[5] | — |
| Ceramic free chamber | Yes[1] | — |
| Waferless auto clean (WAC) | Yes[1] | — |
| CE Certified | Yes[1] | — |
| model | — | 110 SE[3] |
| application focus | — | process development applications[3] |
| process capability | — | deep silicon plasma etching[3] |
| capabilities | — | very high aspect ratio trench etch and profile control[3] |
| configuration | — | multiple configurations with minimum technical intervention[3] |
| System type | — | plasma etch system[6] |
| Supported components | — | MEMS and 3D-IC components[3] |
| Control capability | — | very high aspect ratio trench etch and profile control[6] |
| Physical description | — | compact[3] |
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