Comparison ledger
Leica , Vistec INS 3000, Tokyo Electron Act 12, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Vistec INS 3000Leica | Act 12Tokyo Electron |
|---|---|---|
| OEM | Leica | Tokyo Electron |
| Category | — | — |
| Wafer size | 200mm | Single-pincette shared wafer transfer with centering guides |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Leica , Vistec INS 3000 | Tokyo Electron Act 12 |
| Specifications | ||
| Wafer size | Single 150/200 mm wafer loadport[1] | Single-pincette shared wafer transfer with centering guides |
| Type | Optical defect review station[1] | — |
| Wafer loadport | Single 150/200 mm wafer loadport[1] | — |
| Lighting | Bright field light source; DIC DUV light source[1] | — |
| Camera | UV and DUV camera[1] | — |
| Optics | 6 optics: 150x, 100x, 50x, 25x, 10x, 5x[1] | — |
| Software | Viscon Software[1] | — |
| Data interface | KLARF input[1] | — |
| Configuration | — | 2Coater 2B.L.Cot 4Developer[2] |
| Wafer Size | — | 8 inch[6] |
| Vintage | — | 2003 |
| Coaters & Developers Vintage | — | 2002 |
| Number of Coater Modules | — | 2[2] |
| Number of Bottom-Layer Coat Modules | — | 2[2] |
| Number of Developer Modules | — | 4[2] |
| Direction | — | LEFT HAND SIDE |
| 3 Blocks Interfaced | — | Foup-Process Block-Scanner Interface |
| 3 Wafer Transfer Robot Arms | — | Foup-Process Block-Scanner Interface |
| ➢ Note | — | Exclude HDD OEM Model Description |