Logitech
1WBS2 wafer bonder for wafers up to 100mm alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Applied Materials
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Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
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The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
Logitech
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The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
Branson
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The Branson 101-149-053 Gold Booster is an ultrasonic welding horn booster that doubles the amplitude of the vibration, operating at 20 kHz.
West Bond
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West Bond
10490
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The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.
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