Logitech
1WBS2 wafer bonder for wafers up to 100mm
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Wafer size
Wafer Equipment
Power
110v[1]
What it is
The Logitech 1WBS2 is a wafer bonder. The Logitech 1WBS2 is set up for wafers up to 100 mm. The Logitech 1WBS2 has a digital process display. The Logitech 1WBS2 uses vacuum and positive pressure bonding. The Logitech 1WBS2 has programmable bonding temperature. The Logitech 1WBS2 has a water cooling loop. The Logitech 1WBS2 operates on 110 V.[1][2]
How it works
Where it fits in the process flow
General reference — not yet source-verifiedWafer bonding sits in process flows that need two wafers or substrates combined into a single stack before later thinning, singulation, packaging, or device completion. Wafer bonding is used after surface preparation and layer formation steps that create the bond interface, and before downstream handling steps that depend on the bonded structure remaining intact.
Applications
General reference — not yet source-verifiedWafer bonders are used in semiconductor and microsystem manufacturing to create bonded stacks for device fabrication, packaging, and substrate integration. Wafer bonders are also used in process development and laboratory work where controlled heat and pressure are needed to join prepared wafer surfaces.
What do the numbers mean?
Power & electrical1
Wafer handling2
Observed configurations
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
Unit as listed[1]
- Set up for 100 mm wafers
- Digital process display
- Vacuum and positive pressure bonding
- Programmable bonding temperature
- Water cooling loop
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage110v[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 1WBS2 wafer bonder for wafers up to 100mm are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 1WBS2 wafer bonder for wafers up to 100mm are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 1WBS2 wafer bonder for wafers up to 100mm are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1WBS2 wafer bonder for wafers up to 100mm are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 1WBS2 wafer bonder for wafers up to 100mm are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 1WBS2 wafer bonder for wafers up to 100mm is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]dealer listingwotol.com
- [2]Logitech 1WBS2 wafer bonder for wafers up to 100mm | SemiStar — semistarcorp.comsemistarcorp.com
Last updated Oct 15, 2026.
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