Waferpedia

Comparison ledger

PM100versusTS150

MPI PM100, MPI TS150, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMMPIMPI
CategoryTest & ProbeTest & Probe
Wafer size6"6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyMPI PM100MPI TS150
Specifications
EquipmentMPI TS150 Probe Station[1]—
UseElectrical testing on wafers or chips[1]Electrical testing on wafers or chips[1]
Terminal capacityMaximum of 4 independent terminals + additional chuck grounding[1]—
Wafer compatibilityUp to 6 inch wafers[1]—
Probe positionersMPI PM100 true X,Y,Z micro-positioners[1]True X,Y,Z micro-positioners (MPI PM100)[1]
Probe tipsInterchangeable tungsten (W) contact tips[1]Interchangeable tungsten contact tips; two different diameters available[1]
Chuck stageFine-glide chuck stage on highly stable granite base[1]Fine-glide chuck stage on highly stable granite base[1]
Travel range150 mm x 150 mm and 10 mm x 10 mm coarse and fine X-Y travel range[1]—
Maximum independent terminals—4 independent terminals plus additional chuck grounding[1]
Wafer size compatibility—up to 6 inch[1]
X-Y travel range—150 mm x 150 mm coarse and 10 mm x 10 mm fine[1]
Optics—Binocular optics with oculars or microscope view on monitor[1]
Illumination—Selectable 4 quadrants LED illumination[1]
Measurement capability—Designed for electrical testing on wafers or chips[1]
Maximum terminals—4 independent terminals + additional chuck grounding[1]
Chuck compatibility—wafer sizes up to 6 inch, chip or part of wafers[1]
Stage type—Fine-glide chuck stage on highly stable granite base[1]
X-Y travel range (coarse)—150mm x 150mm[1]
X-Y travel range (fine)—10mm x 10mm[1]
Probe micro-positioners—MPI PM100 true X,Y,Z micro-positioners with interchangeable tungsten (W) contact tips (two different diameter available)[1]
Additional electrical connection—to the chuck for conductive substrates[1]
DC measurement unit—Agilent 4155C Semiconductor Parameter Analyzer with 4x Medium-power SMU, 2xVSU and 2xVMU[1]
DC voltage and current capability—+/- 40 Volts and +/- 100 mA measurement unit (SMU)[1]
DC measurement resolution—10 femtoamp and 0.2 microvolt[1]
Switching box configurations—6 configuration options for standard applications such as FET, bipolar transistors, diodes, 2-points and 4-points general measurements[1]
DC software—Desktop EasyEXPERT software for PC-based GUI instrument control[1]
AC measurement unit—Zürich Instruments MFIA multi-frequency impedance analyzer[1]
AC signal frequency—DC to 5 MHz[1]
AC signal voltage—0 to 2.1 V RMS[1]
DC bias (2 probes)—+/- 10 Volts[1]
DC bias (4 probes)—+/- 3 Volts[1]
Impedance range—1 mOhm to 1 TOhm[1]
AC test fixture—MFITF can be mounted on the MFIA for rapid testing of wire-bonded surface-mounted devices[1]
AC software—LabOne software for PC-based GUI instrument control[1]
Maximum wafer size compatibility—up to 6 inch[1]
Number of independent terminals—maximum 4 plus additional chuck grounding[1]
DC voltage range—+/-40 Volts[1]
DC current range—+/-100 mA[1]
SMU measurement resolution—10 femtoamp and 0.2 microvolt[1]
AC signal frequency range—DC to 5 MHz[1]
AC signal voltage range—0 to 2.1 V RMS[1]
DC bias range (2 probes)—+/-10 Volts[1]
DC bias range (4 probes)—+/-3 Volts[1]
Impedance range (AC)—1 mOhm to 1 TOhm[1]
Probe micro-positioner model—MPI PM100[1]
Probe tip material—tungsten carbide (W)[1]
Type—Probe station[1]
Maximum wafer size—up to 6 inch[1]
Independent terminals—maximum of 4 independent terminals + additional chuck grounding[1]
Probe positioning—Three-axis movement of the probe tips with manual micro-manipulators[1]
Chuck travel range—150 mm x 150 mm coarse and 10 mm x 10 mm fine X-Y travel range[1]
Max independent terminals—4 plus additional chuck grounding[1]
DC measurement voltage—+/- 40 Volts[1]
DC measurement current—+/- 100 mA[1]
DC measurement resolution (current)—10 femtoamp[1]
DC measurement resolution (voltage)—0.2 microvolt[1]
AC DC bias (2 probes)—+/- 10 Volts[1]
AC DC bias (4 probes)—+/- 3 Volts[1]
Primary use—Electrical testing on wafers or chips[1]
Supported wafer size—Up to 6 inch[1]
Supported substrate description—Precise analytical probing of substrates and 150 mm wafers[2]
Chuck stage travel range—180 x 230 mm[2]
Chuck fine-travel range—25 x 25 mm fine micrometer control[2]
Probe platen capacity—Up to 10 DC or 4 RF MicroPositioners[2]
Platen lift positions—Contact (0), separation (300 μm), and loading (3 mm)[2]
Standard wafer chuck supported DUT size—Single DUTs down to 5 x 5 mm or wafers 50 mm through 150 mm[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]mpi.com.twmpi.com.tw