505 Die Attach alternatives

4"

Packaging & Bonding

The Esec 2009 fS E is an epoxy die bonder for 300 mm high-speed die attach applications. The Esec 2009 fS E supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.

4"

Packaging & Bonding

The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is a 300 mm high-speed platform with support for wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.

4"

Packaging & Bonding

The Esec 2100 sD advanced i is a die bonder for die attach applications with wafer support from 4" to 12" and bonding accuracy down to 8 µm in up-looking vision mode.

4"

Packaging & Bonding

The Datacon 2200 evo is a die bonder for epoxy die attach applications.

4"

Packaging & Bonding

The Esec Datacon 2200 evo advanced is a multi-module attach die bonder for die attach and flip chip applications. The Esec Datacon 2200 evo advanced is specified for 4-inch to 12-inch wafer handling and up to ±3 µm X/Y placement accuracy at 3 sigma.

4"

Packaging & Bonding

The Esec Datacon 2200 evo hF is a die bonder on Besi's 3rd-generation 300 mm high-speed platform. The Esec Datacon 2200 evo hF is specified for epoxy die attach applications and supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.