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MRSI

505 Die Attach

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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

505 Die Attach — Inventory photo
Fig. 01505 Die AttachInventory photo[1]

What is it?

Applications

The MRSI 505 Die Attach is used for semiconductor packaging and bonding work. The MRSI 505 is used in die attach and multichip module assembly applications.[5][4][2]

What do the numbers mean?

Wafer handling6

Wafer Size
4", Also used on Substrate 3x5" and Chip on Tape[1]
Accurate?
Comes with Standard Boats / Cassettes[1]
Accurate?
Wafer Size
4"[1]
Accurate?
Also used on Substrate
3x5" and Chip on Tape[1]
Accurate?
Comes with Standard Boats / Cassettes
Yes[1]
Accurate?
Wafer Size
4 inch[1]
Accurate?

Configuration & options7

Vintage (listed unit)
2001[2]
Accurate?
Description
Die Attach/ Multichip Module[2]2 sources
Accurate?
Version
assembly[2]2 sources
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Manufacturer
MRSI[3]
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Model
505[3]
Accurate?
OEM
MRSI[4]
Accurate?
Vintage
2001[1]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What category is the MRSI 505 Die Attach in?

The MRSI 505 Die Attach is in packaging and bonding.[5][4]

What is the MRSI 505 used for?

The MRSI 505 Die Attach is used for semiconductor packaging and bonding work.[5][4]

What assembly work does the MRSI 505 handle?

The MRSI 505 handles die attach and multichip module work.[5][4][2]

Not publicly documented

The following facts about the 505 Die Attach are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 505 Die Attach are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 505 Die Attach are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 505 Die Attach are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 505 Die Attach are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 505 Die Attach is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]fabsurplus.com — fabsurplus.comfabsurplus.com
  3. [3]Equipment inventory listing
  4. [4]waferpedia.com — waferpedia.comwaferpedia.com
  5. [5]505 Die Attach — MRSI | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 20, 2026.

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